WIRE BONDING IN MICROELECTRONICS, 3/E

The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systemsBonding wire metallurgy and characteristics, including copper wireWire bond testingGold-aluminum intermetallic compounds and other interface reactionsGold and nickel-based bond pad plating materials and problemsCleaning to improve bondability and reliabilityMechanical problems in wire bondingHigh-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bondsCopper, low-dielectric-constant (Cu/Lo-k) technology and problemsWire bonding process modeling and simulation

Autorentext
McGraw-Hill authors represent the leading experts in their fields and are dedicated to improving the lives, careers, and interests of readers worldwide

Zusammenfassung
The Industry Standard Guide to Wire Bonding--Fully UpdatedThe definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systemsBonding wire metallurgy and characteristics, including copper wireWire bond testingGold-aluminum intermetallic compounds and other interface reactionsGold and nickel-based bond pad plating materials and problemsCleaning to improve bondability and reliabilityMechanical problems in wire bondingHigh-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bondsCopper, low-dielectric-constant (Cu/Lo-k) technology and problemsWire bonding process modeling and simulationCD includes all the book's full-color figures plus animations

#	Onlineshop	Preis CHF	Versand CHF	Total CHF
1	Seller	0.00	0.00	0.00