Three-Dimensionl Int Circuit L

Klappentext
First published in 1991, this thesis concentrates upon the design of three-dimensional circuits.

Inhalt
Introduction; 1. Two-dimensional chip design; 2. Three-dimensional chip technology; 3. Three-dimensional circuit topology; 4. Three-dimensional cell tesselation; 5. Three-dimensional abutment system; 6. Abutment system configuration; 7. Abutment system evaluation; Conclusions; Appendices; Index.

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